Dec 11, 2024, Geneva, Switzerland — With Qualcomm Technologies, STMicroelectronics has launched its first IoT module, the ST67W611M1. The module is intended for industrial and consumer IoT applications, and it combines ST’s STM32 ecosystem with Qualcomm’s wireless connectivity to further simplify the development of next-generation solutions.
The module is powered by Qualcomm’s QCC743 multiprotocol SoC, which supports Wi-Fi 6, Bluetooth 5.3, and Thread combo connectivity and can be used directly with any STM32 microcontroller or microprocessor. It also features Matter protocol support for future-proof connectivity. A 4MB Flash memory is provided for data retention, along with high-level hardware security with PSA Certified Level 1. Pre-certification and integrated cryptographic accelerators will further contribute to simplifying deployment with minimum design expertise.
“Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs, and RF Products Group (MDRF) at STMicroelectronics.
“Qualcomm’s expertise in highly influential and widely used wireless connectivity technologies is now at product developers’ fingertips and combines with the powerful software, tools, features, and project acceleration offered by the STM32 development ecosystem.”
“This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications,” said Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit, Qualcomm Technologies, Inc. “We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G, and more.”
The ST67W611M1 integrates with the STM32Cube ecosystem, offering suitable tools and software for AI development together with the STM32N6 MCUs and the ST Edge AI Suite. Moreover, the compact 32-lead LGA package greatly eases PCB design and reduces costs for developers. Samples will be available with OEM shipments beginning in Q1 2025.
Source: https://newsroom.st.com/media-center/press-item.html/p4666.html
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