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Vertiv Introduces Solutions for AI-Ready Data Centres

Vertiv Introduces Solutions for AI-Ready Data Centres

As the demand for AI infrastructure surges, data centers face mounting pressure to manage soaring power densities, thermal roads, and operational complexity. Vertiv, a global leader in digital infrastructure solutions, has stepped up with 4 new innovations designed to address these critical challenges. 

It enhances speed, scalability, and efficiency for AI-ready data centers. With AI applications demanding unprecedented levels of computing power and cooling, Vertiv’s new platforms aim to bridge the gap between rising operational demands and sustainable growth.

Scott Armul, Executive Vice President, Global Portfolio, Global Portfolio and Business Units at Vertiv, stated, “With these additions to our portfolio, Vertiv provides easier end-to-end systems integration, faster deployment, improved scalability, and greater power and cooling density to address critical digital infrastructure challenges related to accelerated computing.” 

Vertiv’s New Platforms

 

  1. Vertiv Unify Software: A robust consolidated management platform, Vertiv Unify offers real-time visibility, control, and advanced analytics across power and thermal infrastructure. The software enhances system performance, scalability, and safety while simplifying energy usage reporting. With its plug-and-play design, it ensures seamless integration for a fully connected cloud environment. 
  2. Vertiv SmartRun: This modular prefabricated overhead infrastructure solution integrates high-density power distribution, liquid cooling, and network infrastructure into a single scalable system. With a plug-and-play design and a streamlined one-lift installation process, Vertiv SmartRun can deploy over 1MW per day, which is up to 85% faster than traditional stick-build methods. 
  3. Vertiv CoolLoop RDHx: A high-density rear door heat exchanger, the CoolLoop RDHx is engineered to support the intense thermal demands of AI and high-performance computing (HPC). It seamlessly integrates with direct-to-chip liquid cooling, which offers a room-neutral solution while optimizing cooling efficiency and minimizing energy consumption. 
  4. Vertiv PowerDirect Rack: Designed to maximize power efficiency in AI and HPC environments, the Vertiv PowerDirect Rack delivers scalable power up to 132 kW per rack. Built for Open Compute Project (OCP) ORv3 High Power Rack (HPR) environments, it offers real-time monitoring. 

Source:https://datacentremagazine.com/technology-and-ai/how-vertivs-latest-solutions-support-ai-ready-data-centres

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Rajpalsinh Parmar
Rajpalsinh has been decoding the AI universe for three years, turning tech jargon into tales of wonder and possibility. With a knack for making the abstract tangible, he brings AI's potential to life for everyone.

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